简介:ThinheavilyMg-dopedInGaNandGaNcompoundcontactlayerisusedtoformNi/AuOhmiccontacttop-GaN.ThegrowthconditionsofthecompoundcontactlayeranditseffectontheperformanceofNi/AuOhmiccontacttop-GaNareinvestigated.Itisconfirmedthatthespecificcontactresistivitycanbelowerednearlytwoordersbyoptimizingthegrowthconditionsofcompoundcontactlayer.WhentheflowrateratiobetweenMgandGagassourcesofp++-InGaNlayeris10.6%andthethicknessofp++-InGaNlayeris3nm,thelowestspecificcontactresistivityof3.98×10-5?·cm2isachieved.Inaddition,theexperimentalresultsindicatethatthespecificcontactresistivitycanbefurtherloweredto1.07×10-7?·cm2byoptimizingthealloyingannealingtemperatureto520℃.
简介:AsimpleandeffectiveapproachtoimprovetheswitchingcharacteristicsofAlGaN/AlN/GaNheterostructurefieldeffecttransistors(HFETs)byapplyingavoltagebiasonthesubstrateispresented.Withtheincreaseofthesubstratebias,theOFF-statedraincurrentismuchreducedandtheON-statecurrentkeepsconstant.BoththeON/OFFcurrentratioandthesubthresholdswingaredemonstratedtobegreatlyimproved.Withthethinnedsubstrate,theimprovementoftheswitchingcharacteristicswiththesubstratebiasisfoundtobeevengreater.TheaboveimprovementsoftheswitchingcharacteristicsareattributedtotheinteractionbetweenthesubstratebiasinducedelectricalfieldandthebulktrapsintheGaNbufferlayer,whichreducestheconductivityoftheGaNbufferlayer.
简介:Ⅲ族氮化物(又称GaN基)宽禁带半导体属于新兴的第三代半导体体系,在短波长光电子器件和功率电子器件领域具有重大应用价值。过去10多年,以蓝光和白光LED为核心的半导体照明技术和产业飞速发展,形成了对国家经济和人民生活产生显著影响的高技术产业。近年来GaN基功率电子器件受到了学术界和产业界的高度重视,形成了新的研发和产业化热点。首先介绍了半导体照明技术和产业的发展历程和现状,分析了当前GaN基LED芯片技术面临的关键科学和技术问题;然后重点介绍了GaN基微波功率器件和电力电子器件的发展历程和动态,包括微波功率器件已经取得的突破性进展和产业化现状,电力电子器件相对Si和SiC同类器件的优势和劣势,并对GaN基功率电子器件当前面临的关键科学和技术挑战进行了较详细的分析。
简介:以金属铜箔和镍粉为原料,采用涂覆法制备出Ni—Cu多孔薄膜。采用场发射扫描电子显微镜(FE-SEM)、x射线衍射仪(XRD)、原予力显微镜(AFM)等设备对所制Ni-Cu薄膜的显微结构、物相组成进行表征。通过压泡法对所制多孔薄膜的通量及孔径进行测试,并探讨薄膜的成孔机理。研究表明:所制备Ni-Cu多孔薄膜厚度约为50μm,平均孔径约10girl;涂覆面通过Ni粉的松装烧结形成多孔结构;铜箔一测的孔是由于Kirkendall效应所产生的空位沿着晶界扩散在表面聚集而成。