简介:Moleculardynamics(MD)simulationswereperformedtoinvestigateF+continuouslybombardingSiCsurfaceswithenergiesof100eVatdifferentincidentanglesat300K.Thesimulatedresultsshowthatthesteady-stateuptakeofFatomsincreaseswithincreasingincidentangle.Withthesteady-stateetchingestablished,aSi-C-Freactivelayerisformed.ItisfoundthattheetchingyieldofSiisgreaterthanthatofC.IntheF-containingreactionlayer,theSiFspeciesisdominantwithincidentangleslessthan30o.Forallincidentangles,theCFspeciesisdominantoverCF2andCF3.
简介:Moleculardynamicssimulationswereperformedtostudytheinteractionbetweenatomichydrogenandsiliconcarbide.Inthepresentstudy,wefocusontheeffectofthesurfacetemperatureonHinteractingwithsiliconcarbide.ThesimulationresultsshowthattheretentionofHatomsinthesampledecreaseslinearlywithincreasingsurfacetemperature.ThedepthprofileanalysisshowsthatthesampleismodifiedbyHbombardment,andthedensityofHatomsisgreaterthanthoseofSiandCatomsneartheinterfaceregionbetweentheH-containingregionandthebulk.However,nearthesurfaceregionthedensitiesofH,SiandCatomsarealmostequivalent.Inthemodifiedlayer,thebondsconsistofSi-CandSi-HandC-H.ThefractionofSi-Cbondsisthegreatest.OnlyafewC-Hbondsarepresent.
简介:利用同步辐射(BSRF)漫散射站四圆衍射仪,对SiC体单晶的结构进行了判定以及对利用常压化学气相沉积(APCVD)生长的3C-SiC/Si(001)中的孪晶及含量进行了分析。六方{10-15}极图证明了该SiC单晶为6H(H为Hexagonal的缩写)结构。对3C-SiC外延薄膜,Φ扫描证明了3C-SiC外延生长于Si衬底上,外延取向关系为:(001)3C-SiC//(001)Si,[111]3C-SiC//[111]Si。3C-SiC的{111}极图在x=15.8°出现了新的衍射,采用六方{10-10}极图以及基体倒格点111、孪晶倒格点002的Mapping分析了x=15.8°处产生的衍射为3C-SiC孪晶所致,并利用ω扫描估算了孪晶的含量约为1%。
简介:Sinteredsiliconcarbide(SiC)wasetchedbyadielectricbarrierdischargesource.Ahighvoltagebipolarpulsewasusedwithheliumgasfortheplasmageneration.OnestablefilamentplasmawasgeneratedandcouldbeusedforSiCetching.Astheprocessinggas(NF3)mixingrateincreased,thewidthanddepthoftheetchingprofilebecamenarroweranddeeper.ThedifferentiatedV-QLissajousmethodwasusedformeasuringthecapacitances(Ceq)oftheelectrodeaftertheplasmaturnedon.ThewidthoftheetchingprofilewasproportionaltoCeq.Asthecurrentpeakvalue/smxofthesubstratecurrentincreased,thevolumeremovalrateofSiCincreased.Theetchdepthwasproportionaltotheratioof/smxtoCeq.Additionally,becauseofthedifferentcharacteristicsoftheplasmadisksonSiCsubstratebythevoltagepolarity,theetchingprofilewasunstable.However,inhighNF3mixingprocess,theetchingprofilebecamestableanddeeper.
简介:Ahighlyreliableinterfaceofself-alignedbarrierCuSiNthinlayerbetweentheCufilmandthenano-porousSiC:H(p-SiC:H)cappingbarrier(k=3.3)hasbeendevelopedinthepresentwork.Withtheintroductionofself-alignedbarrier(SAB)CuSiNbetweenaCufilmandap-SiC:Hcappingbarrier,theinterfacialthermalstabilityandtheadhesionoftheCu/p-SiC:Hfilmareconsiderablyenhanced.AsignificantimprovementofadhesionstrengthandthermalstabilityofCu/p-SiC:H/SiOC:Hfilmstackhasbeenachievedbyoptimizingthepre-cleanstepbeforecap-layerdepositionandbyformingtheCuSiN-likephase.ThiscaplayeronthesurfaceoftheCucanprovideamorecohesiveinterfaceandeffectivelysuppressCuatommigrationaswell.