LIGAtechniquehasbeendevelopedsince1993atBSRF,includingthefabricationofLIGAmask,deepX-rayLithography,electroplating,thepouringmoldingandtheapplicationsinsomefields.TheLIGAmaskwithgoldabsorbingstructuresof20μmthicknessand5μmwidthandKaptonmembraneofaround5μmthicnesshasbeensuccessfullfabricatedandappliedtothedeepX-raylithographywiththePMMAstructureof1mmthicknessorobove.thebeamlineformawigglerisusedforthedeepX-raylithographyofLIGAstatiionandisopentootheinstitutesresearchingthedeepX-raylithography.ThenormalprocessofLIGAtechniquewiththeexceptionofmoldinghasbeenestablishedwiththePMMAstructuresof500μmthicknessatBSRF.ThelargestaspectratioofPMMAstructruescanreachabout50withtheheightof500μmandthelateralsiaeof10μm.Thenickelandcopperstructureswiththetheicknessof0.5mmand1mmhavebeenmadebyusingtheelectroplatingtechnique.TheSU8asaresistmaterialofdeepetchlithographywithUVlightisalsodevelopedinthefabricationofLIGAmaskandsomedevicesatBSRF.Electromagneticsteppingmicromotor,haetexchange,accelerator,structuresusedintheEDM(electrodischargemachinging)arebeingdevelopedforthefutureapplications.
