简介:[篇名]Bi-2212:AnHTSCoatedConductor,[篇名]Carbonnanotube-perovskite-compositesasnewelectrodematerial,[篇名]CeO{sub}2bufferlayerbypulsedlaserdepositionforYBCOcoatedconductor,[篇名]CeO{sub)2BufferLayersDepositedbyPulsedLaserDepositionforTFA-MODYBa{sub}2Cu{sub}3O{sub)(7-x)SuperconductingTape,[篇名]Characteristicofthin-filmNTCthermalSensors,[篇名]Characteristicsofcobalt-dopedzincoxidethinfilmspreparedbypulsedlaserdeposition,[篇名]CharacteristicsofTiO{sub}2ThinFilmasaPhotocatalystPrepardUsing-thePulsedLaserDepositionMethod.
简介:Co-dopingDepositionofp-typeZnOThinFilmsusingKrFExcimerLaserAblation;ComparisonofGrowthMorphologyinGe(001)HomoepitaxyUsingPulsedLaserDepositionandMBE;CompositionandstructureofBCNfilmspreparedbyionbeam-assistedpulsedlaserdeposition;Compositionofβ-FeSi{sub}2thin-filmsgrownbyapulsedlaserdepositionmethod
简介:结合预制件一次性模压成型和真空气压浸渗技术制备具有双层结构的高体积分数(60%~65%)、可激光焊接Sip-SiCp/Al混杂复合材料。该复合材料的组织结构均匀、致密,增强相颗粒均匀地分布在复合材料中,Sip/Al-SiCp/Al界面均匀、连续、结合紧密。性能测试表明,Sip-SiCp/Al混杂复合材料具有密度低(2.96g/cm^3)、热导率高(194W/(m·K))、热膨胀系数小(7.0×10^-6K-1)、气密性好(1.0×10^-3(Pa·cm^3)/s)等优异特性。焊接试验表明,Sip-SiCp/Al混杂复合材料具有良好的激光焊接特性,其焊缝平整、致密,微观组织均匀,没有生成明显的气孔和脆性相Al4C3。同时,Sip-SiCp/Al混杂复合材料激光封焊后优异的气密性(4.8×10^-2(Pa·cm^3)/s)能够满足现代电子封装行业对气密性的严格要求。
简介:Increasingtheefficiencyoflaserheattreatmentofalathetoolwithallowancefortheinfluenceofthecuttingregimes.Laserbeamcladdingcharacteristicsofhighchromiumcastirononcarbonsteel.Fourieropticalresearchonwide-bandscanningrotatingmirrorofthehighpowerlaser.LaserBeamCladdingCharacteristicsofWCDispersedHastelloyonCarbonSteel.