简介:
简介:以Sn8Zn3Bi为研究对象,采用微合金化方法研究了不同含量的Cu元素对其显微组织、钎料合金与Cu基板钎焊后的界面金属间化合物(IMc)层尺寸及焊接接头剪切强度的影响。结果表明,Sn8Zn3Bi-xCu/Cu(x=0.3,0.5,0.8,1.0,1.5)焊接界面IMC主要为层状Cu5Zn8相。随着Cu含量的增加,界面IMC层的厚度逐渐减小,接头的剪切强度逐渐提高,Sn8Zn3Bi-1.5Cu/Cu接头剪切强度较Sn8Zn3Bi/Cu显著提高。经120℃时效处理后,Sn8Zn3Bi-xCu/Cu(x=0,0.3,0.5,0.8,1.0,1.5)焊接接头剪切强度都明显下降,接头断裂方式由韧性断裂转为局部脆性断裂,但添加了Cu元素的钎料界面IMC生长速度较Sn8Zn3Bi钎料慢,因此Cu元素的添加抑制了界面IMC层的生长。
简介:Thisstudywasconductedtodiscusstheeffectofrollingstrainonmicrostructureandtensilepropertiesofdual-phaseMg-8Li-3Al-2Zn-0.5Y(wt%)alloy,whichwaspreparedbycasting,andthenhomogenizedandrolledat200℃.Therollingprocesswasconductedwith10%reductionperpassandfivedifferentaccumulatedstrains,varyingfrom10%to70%.Theresultsindicatethattheas-castandas-rolledMg-8Li-3Al-2Zn-0.5Yalloysarecomposedofα-Mg,β-Li,AlLiandAl2Yphases.Afterrollingprocess,anisotropicmicrostructurewasobserved.a-Mgphasegotelongatedinbothrollingdirectionandtransversedirectionwiththeadditionofrollingstrain.Consequently,thestrengthofthealloyinbothdirectionswasnotablyimprovedwhereastheelongationdeclined,mainlycausedbystrainhardeninganddispersionstrengthening.Thetensilepropertiesoftheas-rolledalloysintheRD,nomattertheYS,UTSortheelongation,arehigherthanthoseoftheTDduetotheirlargerdeformationstrainandsignificantanisotropyinthehcpα-Mgphase.Inaddition,thefractureandstrengtheningmechanismofthetestedalloyswerealsoinvestigatedsystematically.
简介:Aneffectivedispersion-strengtheningphaseinAl-8Fe-2Mo-2Zr-2Nd-0.7Ti-1.6SialloywasidentifiedtobeanagedprecipitatephasewithpossiblechemicalstoichiometryofAl20(Ti,Mo)2Ndandfcccrystalstructurewithao=1.455nm.ThestructurewasdeterminedtobeFm3mspacegroup.