简介：CreeppropertyofsolderalloysisoneoftheimportantfactorstoaffectthereliabilityofsolderedjointsinSMT(surfacemounttechnology).Particle-enhancementisawaytoimprovethepropertiesofsolderalloysandhascausedmuchmoreattentionthanbefore.Temperaturesappliedtosolderedjointsareoneoftheprimaryfactorsofaffectingcreeppropertiesofparticleenhancementcompositesolderedjoints.Inthispapersingleshearlapcreepspecimenswitha1mm2cross-sectionalareawerefabricatedusingCuparticleenhancement63Sn37Pbbasedcompositesolderedjointsand63Sn37Pbeutecticsolderedjointstoexaminetheinfluenceoftemperatureoncreepbehaviorofsolderedjoints.ResultsindicatedthatthecreepresistanceofsolderedjointsofCuparticleenhancement63Sn37Pbbasedcompositesolderedjointwasgenerallysuperiortothatoftheconventional63Sn37Pbsolderedjoint.Atthesametime,creeprupturelifeofthecompositesolderedjointwasdeclinedwithincreasingtemperatureanddropfasterthanthatoftheconventional63Sn37Pbeutecticsolderedjoint.

简介：ThesecondphaseparticledispersedinmicroaUoyedsteelhasdifferenteffectsongraingrowthdependingontheirsizeandvolumefractionofthesecondphaseparticleswhichwillchangeduringweldingthermalcycles.Theparticlecoarseninganddissolutionkineticsmodelwasanalyzedforcontinuousheatingandcooling.Inaddition,basedonexperimentaldata,thecoupledequationofgraingrowthwasestablishedbyintrodacinglimitedsizeofgraingrowthwiththeconsiderationofthesecondphaseparticlespinningeffects.UsingMonteCarlomethodbasedonexperimentaldatamodel,thegraingrowthsimulationforheat-affectedzoneofmicroalloyedsteelweldswasachieved.Thecalculatingresultswerewellinagreementwiththatofexperiments.