简介:AdhesionimprovementofCVDdiamondfilimbyintroducinganelectro-depositedinterlayer;Agitation:themostversatiledegreeoffreedomforsurfacefinishers;Developmentofhydroxyapatitecoatingonporoustitaniumviaelectro-depositiontechnique;EffectofintensemagneticfieldonCdTeelectro-deposition;ElectrodepositionofMetallicLithiumonaTungstenElectrodein1-Butyl-l-methylpyrrolidiniumBis(tritluoromethanesulfone)imideRoom-temperatureMoltenSalt
简介:[篇名]Electro-depositionoftantalumontumgstenandnickelinLiF-NaF-CaF{sub}2meltcontainingK{sub}2TaF{sub}7electrochemicalstudy,[篇名]Electro-EpitaxialBufferLaycrsforREBCOTspeArchitectures,[篇名]EQCMwithair-gapexcitationelectrode.Calibrationtestswithcopperandoxygencoatings,[篇名]FormationofWell-definedNanocolumnsbyIonTrackingLithography,[篇名]Fundamentalexperimentalstudyonfreefabricationofnanocrystallinecopperbulkbyselectiveelectrodepositionwithelectrolytejet,[篇名]Magneticnanowirearraysobtainedbyelectro-depositioninorderedaluminatemplates,[篇名]Morphologicalcharacteristicsofnickelparticleselectrodepositedfromchloridedominantsolution.
简介:铁镍基合金Incoloy825在焊接时容易出现热裂纹和气孔等缺陷;当在容器制造中受到不正确的加热(中温敏化)后,使用在某些介质中可能产生晶间腐蚀。缺陷的产生与原材料和焊接工艺有直接关系。在原材料方面应控制母材的化学成分和选择合适的焊材;在焊接工艺方面,焊前应保证母材和焊材干净,焊接过程中高温熔池和焊缝应得到有效保护,控制焊接参数,减小线能量,减少焊接接头在中温的停留时间。