简介：

简介：AsinteredTi_(13)Cu_(87)targetwassputteredbyreactivedirectcurrent(DC)magnetronsputteringwithagasmixtureofargon/nitrogenfordifferentsputteringpowers.Titanium-copper-nitrogenthinfilmsweredepositedonSi(111),glassslideandpotassiumbromide(KBr)substrates.Phaseanalysisandstructuralpropertiesoftitanium-copper-nitrogenthinfilmswerestudiedbyX-raydiffraction(XRD).ThechemicalbondingwascharacterizedbyFouriertransforminfrared(FTIR)spectroscopy.TheresultsfromXRDshowthattheobservedphasesarenano-crystallitecubicantirheniumoxide(antiReO_3)structuresoftitaniumdopedCu_3N(Ti:Cu_3N)andnanocrystallitefacecenteredcubic(fcc)structuresofcopper.ScanningelectronmicroscopyandenergydispersiveX-rayspectroscopy(SEM/EDX)wereusedtodeterminethefilmmorphologyandatomictitanium/copperratio,respectively.Thefilmspossesscontinuousandagglomeratedstructurewithanatomictitanium/copperratio(～0.07)belowthatoftheoriginaltarget(～0.15).Thetransmittancespectraofthecompositefilmsweremeasuredintherangeof360nmto1100nm.Filmthickness,refractiveindexandextinctioncoefficientwereextractedfromthemeasuredtransmittanceusingareverseengineeringmethod.Inthevisiblerange,thehigherabsorptioncoefficientofthefilmspreparedatlowersputteringpowerindicatesmorenitrificationincomparisontothosepreparedathighersputteringpower.ThisisconsistentwiththeformationoflargerTi:Cu_3Ncrystallitesatlowersputteringpower.Thedepositionratevs.sputteringpowershowsanabrupttransitionfrommetallicmodetopoisonedmode.Acomplicatedbehaviorofthefilms'resistivityuponsputteringpowerisshown.