摘要
TheCu/Sn-3.OAg-0.5Cu/Cubuttingsolderjointswerefabricatedtoinvestigatetheevolutionoftheinterfacialintermetalliccompound(IMC)andthedegradationofthetensilestrengthofsolderjointsundertheeffectofelectromigration(EM)andagingprocesses.Scanningelectronmicroscopy(SEM)resultsindicatedthattheCu_6Sn_5interfacialIMCpresentedobviousasymmetricalgrowthwiththeincreaseofEMtimeundercurrentdensityof1.78×10~4A/cm~2at100℃,andthegrowthofanodicIMCpresentedaparabolicrelationshipwithtimewhilethecathodicIMCgotthinnergradually.However,asforagingsamplesat100℃withoutcurrentstressing,theCu_6Sn_5IMCpresentedasymmetricalgrowthwithaslowerratethantheanodicIMCofEMsamples.Thetensileresultsindicatedthatthetensilestrengthofthesolderjointsundercurrentstressdeclinedmoredrasticwithtimethantheagingsamples,andthefracturemodetransformedfromductilefracturetobrittlefracturequicklywhilethefracturemodeofagingsamplestransformedfromcup-coneshapedfracturetomicroporousgatheringfractureinaslowway.
出版日期
2016年03月13日（中国期刊网平台首次上网日期，不代表论文的发表时间）
