A Single Mode Hybrid Ⅲ-Ⅴ/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection-中国期刊网

摘要 AsinglemodehybridⅢ-Ⅴ/siliconon-chiplaserbasedontheflip-chipbondingtechnologyforon-chipopticalinterconnectionisdemonstrated.AsinglemodeFabry-Perotlaserstructurewithmicro-structuresonanInPridgewaveguideisdesignedandfabricatedonanInP/AlGaInAsmultiplequantumwellepitaxiallayerstructurewaferbyusingi-linelithography.Then,asiliconwaveguideplatformincludingalasermountingstageisdesignedandfabricatedonasilicon-on-insulatorsubstrate.Thesinglemodelaserisflip-chipbondedonthelasermountingstage.Thelasinglightisbutt-couplingtothesiliconwaveguide.Thelaserpoweroutputfromasiliconwaveguideis1.3mW,andthethresholdis37mAatroomtemperatureandcontinuouswaveoperation.

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A Single Mode Hybrid Ⅲ-Ⅴ/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection

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A Single Mode Hybrid Ⅲ-Ⅴ/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection

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