The Residual Strain Measurement of Thin Conductive Metal Wire after Electrical Failure with SEM Moir

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摘要 Inthisstudy,theresidualstrainofathinconductivemetalwireonapolymersubstrateafterelectricalfailureismeasuredwithSEMmoir′e.Focusedionbeam(FIB)millingisappliedtofabricatemicronmoir′egratingsonthesurfacesofconstantanwiresandtherandomphaseshiftingtechniqueisusedtoprocessmoir′efringes.Thevirtualstrainmethodisbrieflyintroducedandusedtocalculatetherealstrainofspecimens.Inordertostudytheinfluenceofadefectontheelectricalfailureoftheconstantanwire,experimentswereconductedontwospecimens,onewithacrack,whiletheotheronewithoutanycrack.Bycomparingtheresults,wefoundthatthedefectmakesthecriticalbeamcurrentofelectricalfailuredecrease.Inaddition,thespecimensweresubjectedtocompressionafterelectricalfailure,inagreementwiththeobservedcrackclosureofthespecimen.Thesuccessfulresultsdemonstratethatthemoir′emethodiseffectivetocharacterizethefull-fielddeformationofconstantanwiresonthepolymermembrane,andhasagoodpotentialforfurtherapplicationtothedeformationmeasurementofthinfilms.
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出版日期 2016年04月14日(中国期刊网平台首次上网日期,不代表论文的发表时间)
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